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PIC16F818-I/P 参数 Datasheet PDF下载

PIC16F818-I/P图片预览
型号: PIC16F818-I/P
PDF下载: 下载PDF文件 查看货源
内容描述: 二十零分之一十八引脚增强型闪存微控制器采用纳瓦技术 [18/20-Pin Enhanced Flash Microcontrollers with nanoWatt Technology]
分类和应用: 闪存微控制器和处理器外围集成电路光电二极管PC时钟
文件页数/大小: 176 页 / 2941 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC16F818/819  
TABLE 7-1:  
CAPACITOR SELECTION FOR  
THE TIMER1 OSCILLATOR  
7.6  
Timer1 Oscillator  
A crystal oscillator circuit is built-in between pins T1OSI  
(input) and T1OSO (amplifier output). It is enabled by  
setting control bit, T1OSCEN (T1CON<3>). The  
oscillator is a low-power oscillator, rated up to  
32.768 kHz. It will continue to run during Sleep. It is  
primarily intended for a 32 kHz crystal. The circuit for a  
typical LP oscillator is shown in Figure 7-3. Table 7-1  
shows the capacitor selection for the Timer1 oscillator.  
Osc Type  
Freq  
C1  
C2  
LP  
32 kHz  
33 pF  
33 pF  
Note 1: Microchip suggests this value as a starting  
point in validating the oscillator circuit.  
2: Higher capacitance increases the stability  
of the oscillator but also increases the  
start-up time.  
The user must provide a software time delay to ensure  
proper oscillator start-up.  
3: Since each resonator/crystal has its own  
characteristics, the user should consult  
the resonator/crystal manufacturer for  
Note:  
The Timer1 oscillator shares the T1OSI  
and T1OSO pins with the PGD and PGC  
pins used for programming and  
debugging.  
appropriate  
values  
of  
external  
components.  
When using the Timer1 oscillator, In-Circuit  
Serial Programming™ (ICSP™) may not  
function correctly (high-voltage or low-  
voltage) or the In-Circuit Debugger (ICD)  
may not communicate with the controller.  
As a result of using either ICSP or ICD, the  
Timer1 crystal may be damaged.  
4: Capacitor values are for design guidance  
only.  
7.7  
Timer1 Oscillator Layout  
Considerations  
The Timer1 oscillator circuit draws very little power  
during operation. Due to the low-power nature of the  
oscillator, it may also be sensitive to rapidly changing  
signals in close proximity.  
If ICSP or ICD operations are required, the  
crystal should be disconnected from the  
circuit (disconnect either lead) or installed  
after programming. The oscillator loading  
capacitors may remain in-circuit during  
ICSP or ICD operation.  
The oscillator circuit, shown in Figure 7-3, should be  
located as close as possible to the microcontroller.  
There should be no circuits passing within the oscillator  
circuit boundaries other than VSS or VDD.  
FIGURE 7-3:  
EXTERNAL  
If a high-speed circuit must be located near the oscilla-  
tor, a grounded guard ring around the oscillator circuit,  
as shown in Figure 7-4, may be helpful when used on  
a single-sided PCB or in addition to a ground plane.  
COMPONENTS FOR THE  
TIMER1 LP OSCILLATOR  
C1  
33 pF  
PIC16F818/819  
T1OSI  
FIGURE 7-4:  
OSCILLATOR CIRCUIT  
WITH GROUNDED  
GUARD RING  
XTAL  
32.768 kHz  
T1OSO  
C2  
VSS  
33 pF  
OSC1  
OSC2  
Note:  
See the Notes with Table 7-1 for additional  
information about capacitor selection.  
RB7  
RB6  
RB5  
DS39598E-page 60  
2004 Microchip Technology Inc.