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PIC16F722-I/SS 参数 Datasheet PDF下载

PIC16F722-I/SS图片预览
型号: PIC16F722-I/SS
PDF下载: 下载PDF文件 查看货源
内容描述: 28 /40/ 44引脚闪存单片机采用纳瓦XLP技术 [28/40/44-Pin Flash Microcontrollers with nanoWatt XLP Technology]
分类和应用: 闪存微控制器
文件页数/大小: 302 页 / 4540 K
品牌: MICROCHIP [ MICROCHIP TECHNOLOGY ]
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PIC16F72X/PIC16LF72X
23.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
(†)
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
DD
with respect to V
SS
, PIC16F72X ............................................................................... -0.3V to +6.5V
Voltage on V
CAP
pin with respect to V
SS
, PIC16F72X ....................................................................... -0.3V to +4.0V
Voltage on V
DD
with respect to V
SS
, PIC16LF72X ............................................................................. -0.3V to +4.0V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
SS
........................................................................... -0.3V to (V
DD
+ 0.3V)
Total power dissipation
(1)
............................................................................................................................... 800 mW
Maximum current out of V
SS
pin ...................................................................................................................... 95 mA
Maximum current into V
DD
pin ......................................................................................................................... 70 mA
Clamp current, I
K
(V
PIN
< 0 or V
PIN
> V
DD
)................................................................................................................± 20 mA
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by all ports
(2)
, -40°C
T
A
+85°C for industrial ........................................................ 200 mA
Maximum current sunk by all ports
(2)
, -40°C
T
A
+125°C for extended........................................................ 90 mA
Maximum current sourced by all ports
(2)
, 40°C
T
A
+85°C for industrial ................................................... 140 mA
Maximum current sourced by all ports
(2)
, -40°C
T
A
+125°C for extended................................................... 65 mA
Note 1:
Power dissipation is calculated as follows: P
DIS
= V
DD
x {I
DD
I
OH
} +
{(V
DD
– V
OH
) x I
OH
} +
∑(V
O
l x
I
OL
).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
©
2009 Microchip Technology Inc.
DS41341E-page 211