PIC16F688
11.2.1
POWER-ON RESET
FIGURE 11-2:
RECOMMENDED MCLR
CIRCUIT
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper
operation. To take advantage of the POR, simply
connect the MCLR pin through a resistor to VDD. This
will eliminate external RC components usually needed
to create Power-on Reset. A maximum rise time for
VDD is required. See Section 14.0 “Electrical Specifi-
cations” for details. If the BOR is enabled, the maxi-
mum rise time specification does not apply. The BOR
circuitry will keep the device in Reset until VDD reaches
VBOD (see Section 11.2.4 “Brown-Out Reset
(BOR)”).
VDD
R1
PIC16F688
1 kΩ (or greater)
MCLR
C1
0.1 μF
(optional, not critical)
Note:
The POR circuit does not produce an
internal Reset when VDD declines. To
re-enable the POR, VDD must reach Vss
for a minimum of 100 μs.
11.2.3
POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates from the 31 kHz
LFINTOSC oscillator. For more information, see
Section 3.5 “Internal Clock Modes”. The chip is kept
in Reset as long as PWRT is active. The PWRT delay
allows the VDD to rise to an acceptable level. A Config-
uration bit, PWRTE, can disable (if set) or enable (if
cleared or programmed) the Power-up Timer. The
Power-up Timer should be enabled when Brown-out
Reset is enabled, although it is not required.
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
11.2.2
MCLR
The Power-up Timer delay will vary from chip-to-chip
and vary due to:
PIC16F688 has a noise filter in the MCLR Reset path.
The filter will detect and ignore small pulses.
• VDD variation
It should be noted that a WDT Reset does not drive
MCLR pin low.
• Temperature variation
• Process variation
The behavior of the ESD protection on the MCLR pin
has been altered from early devices of this family.
Voltages applied to the pin that exceed its specification
can result in both MCLR Resets and excessive current
beyond the device specification during the ESD event.
For this reason, Microchip recommends that the MCLR
pin no longer be tied directly to VDD. The use of an RC
network, as shown in Figure 11-2, is suggested.
See DC parameters for details (Section 14.0
“Electrical Specifications”).
Note:
Voltage spikes below VSS at the MCLR
pin, inducing currents greater than 80 mA,
may cause latch-up. Thus, a series resis-
tor of 50-100 Ω should be used when
applying a “low” level to the MCLR pin,
rather than pulling this pin directly to VSS.
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word register. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the RA3/MCLR pin
becomes an external Reset input. In this mode, the
RA3/MCLR pin has a weak pull-up to VDD.
© 2007 Microchip Technology Inc.
DS41203D-page 113
MICROCHIP [ MICROCHIP ]
