PIC16F631/677/685/687/689/690
20-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
3
e
b
α
h
h
c
φ
A2
A
L
β
A1
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
20
1.27 BSC
Overall Height
A
–
–
2.65
–
Molded Package Thickness
Standoff §
A2
A1
E
2.05
0.10
–
–
0.30
Overall Width
10.30 BSC
Molded Package Width
Overall Length
E1
D
h
7.50 BSC
12.80 BSC
Chamfer (optional)
Foot Length
0.25
0.40
–
0.75
1.27
L
–
Footprint
L1
φ
1.40 REF
Foot Angle
0°
0.20
0.31
5°
–
–
–
–
–
8°
Lead Thickness
Lead Width
c
0.33
0.51
15°
b
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-094B
© 2007 Microchip Technology Inc.
DS41262D-page 277
MICROCHIP [ MICROCHIP ]
