PIC16F630/676
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
c
φ
A2
A
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
14
0.65 BSC
Overall Height
Molded Package Thickness
Standoff
A
–
–
1.20
1.05
0.15
A2
A1
E
0.80
0.05
1.00
–
Overall Width
Molded Package Width
Molded Package Length
Foot Length
6.40 BSC
E1
D
4.30
4.90
0.45
4.40
4.50
5.10
0.75
5.00
L
0.60
Footprint
L1
φ
1.00 REF
Foot Angle
0°
–
–
–
8°
Lead Thickness
Lead Width
c
0.09
0.20
0.30
b
0.19
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087B
DS40039E-page 118
© 2007 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
