PIC16F870/871
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E
E1
p
D
B
2
1
n
α
A
c
A2
A1
φ
L
β
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
28
MAX
n
p
Number of Pins
Pitch
28
.026
.073
.068
.006
.309
.207
.402
.030
.007
4
0.65
Overall Height
A
.068
.064
.002
.299
.201
.396
.022
.004
0
.078
1.73
1.63
1.85
1.73
0.15
7.85
5.25
10.20
0.75
0.18
101.60
0.32
5
1.98
Molded Package Thickness
Standoff
A2
A1
E
.072
.010
.319
.212
.407
.037
.010
8
1.83
0.25
8.10
5.38
10.34
0.94
0.25
203.20
0.38
10
0.05
7.59
5.11
10.06
0.56
0.10
0.00
0.25
0
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
c
Lead Thickness
Foot Angle
φ
Lead Width
B
α
β
.010
0
.013
5
.015
10
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
1999 Microchip Technology Inc.
Preliminary
DS30569A-page 139
MICROCHIP [ MICROCHIP ]
