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PIC16F870-I/SP 参数 Datasheet PDF下载

PIC16F870-I/SP图片预览
型号: PIC16F870-I/SP
PDF下载: 下载PDF文件 查看货源
内容描述: 40分之28引脚8位CMOS闪存微控制器 [28/40-Pin 8-Bit CMOS FLASH Microcontrollers]
分类和应用: 闪存微控制器和处理器外围集成电路装置光电二极管PC时钟
文件页数/大小: 156 页 / 2816 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC16F870/871  
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)  
E1  
D
2
α
n
1
E
A2  
A
L
c
B1  
B
β
A1  
p
eB  
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
40  
MAX  
n
p
Number of Pins  
Pitch  
40  
.100  
.175  
.150  
2.54  
Top to Seating Plane  
A
.160  
.190  
.160  
4.06  
3.56  
4.45  
3.81  
4.83  
4.06  
Molded Package Thickness  
Base to Seating Plane  
Shoulder to Shoulder Width  
Molded Package Width  
Overall Length  
A2  
A1  
E
.140  
.015  
.595  
.530  
2.045  
.120  
.008  
.030  
.014  
.620  
5
0.38  
15.11  
13.46  
51.94  
3.05  
0.20  
0.76  
0.36  
15.75  
5
.600  
.545  
2.058  
.130  
.012  
.050  
.018  
.650  
10  
.625  
.560  
2.065  
.135  
.015  
.070  
.022  
.680  
15  
15.24  
13.84  
52.26  
3.30  
0.29  
1.27  
0.46  
16.51  
10  
15.88  
14.22  
52.45  
3.43  
0.38  
1.78  
0.56  
17.27  
15  
E1  
D
Tip to Seating Plane  
Lead Thickness  
L
c
Upper Lead Width  
B1  
B
Lower Lead Width  
Overall Row Spacing  
Mold Draft Angle Top  
Mold Draft Angle Bottom  
*Controlling Parameter  
Notes:  
eB  
α
β
5
10  
15  
5
10  
15  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010” (0.254mm) per side.  
JEDEC Equivalent: MO-011  
Drawing No. C04-016  
DS30569A-page 142  
Preliminary  
1999 Microchip Technology Inc.  
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