PIC16CR54C
12.0 PACKAGING INFORMATION
12.1
Package Marking Information
18-Lead PDIP
Example
Example
MMMMMMMMMMMMXXX
MMMMMMMMXXXXXXX
PIC16CR54C-
04/P123
9813 HBA
AABB CDE
18-Lead SOIC
MMMMMMMMM
XXXXXXXXX
PIC16CR54C-
04I/S0218
AABB CDE
9810 HDK
20-Lead SSOP
Example
MMMMMMMM
XXXXXXXX
AABB CDE
PIC16CR54C
04I/218
9810 HBP
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
BB
C
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D
E
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
*
Standard ROM marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For ROM marking
beyond this, certain price adders apply. Please check with your Microchip
Sales Office.
1998 Microchip Technology Inc.
Preliminary
DS40191A-page 73
MICROCHIP [ MICROCHIP ]
