PIC16C5X
Package Type: K04-013 28-Lead Ceramic Dual In-line with Window (JW) – 600 mil
E
W
D
2
1
n
E1
eB
A
A1
R
L
c
B1
A2
p
B
Units
INCHES*
NOM
0.600
28
MILLIMETERS
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
MIN
MAX
MIN
NOM
15.24
28
MAX
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
W
0.098
0.100
0.019
0.058
0.005
0.010
0.185
0.128
0.038
0.138
1.460
0.520
0.580
0.660
0.280
0.102
2.49
0.41
2.54
0.47
2.59
0.53
1.65
0.25
0.30
5.08
3.70
1.52
3.81
37.85
13.36
15.24
18.03
7.37
0.016
0.050
0.000
0.008
0.170
0.110
0.015
0.125
1.430
0.514
0.560
0.610
0.270
0.021
0.065
0.010
0.012
0.200
0.146
0.060
0.150
1.490
0.526
0.600
0.710
0.290
1.27
0.00
1.46
0.13
0.20
0.25
Top to Seating Plane
4.32
4.70
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
2.78
3.24
0.00
0.95
3.18
3.49
36.32
13.06
14.22
15.49
6.86
37.08
13.21
14.73
16.76
7.11
Package Width
Radius to Radius Width
Overall Row Spacing
Window Diameter
*
Controlling Parameter.
1998 Microchip Technology Inc.
Preliminary
DS30453B-page 203
MICROCHIP [ MICROCHIP ]
