PIC16C5X
21.0 PACKAGING INFORMATION
Package Type: K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
E
D
2
α
n
1
E1
A1
A
R
L
c
A2
B1
β
p
B
eB
Units
INCHES*
NOM
0.300
18
MILLIMETERS
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
MAX
MIN
NOM
7.62
18
MAX
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
α
0.100
0.018
0.060
0.005
0.010
0.155
0.095
0.020
0.130
0.895
0.255
0.250
0.349
10
2.54
0.013
0.023
0.33
1.40
0.46
1.52
0.13
0.25
3.94
2.41
0.51
3.30
22.73
6.48
6.35
8.85
10
0.58
†
0.055
0.000
0.005
0.110
0.075
0.000
0.125
0.890
0.245
0.230
0.310
5
0.065
0.010
0.015
0.155
0.115
0.020
0.135
0.900
0.265
0.270
0.387
15
1.65
0.25
0.38
3.94
2.92
0.51
3.43
22.86
6.73
6.86
9.83
15
0.00
0.13
2.79
1.91
0.00
3.18
22.61
6.22
5.84
7.87
5
‡
‡
β
5
10
15
5
10
15
*
Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
1998 Microchip Technology Inc.
Preliminary
DS30453B-page 195
MICROCHIP [ MICROCHIP ]
