PIC16F870/871
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
E
E1
#leads=n1
D
D1
n 1 2
CH2 x 45°
CH1 x 45°
α
A3
A2
A
35°
B1
B
c
A1
β
p
E2
D2
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
44
MAX
n
p
Number of Pins
Pitch
44
.050
11
1.27
11
Pins per Side
Overall Height
n1
A
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
0
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.011
.029
.020
5
.180
4.19
3.68
0.51
0.61
1.02
0.00
17.40
17.40
16.51
16.51
14.99
14.99
0.20
0.66
0.33
0
4.39
3.87
0.71
0.74
1.14
0.13
17.53
17.53
16.59
16.59
15.75
15.75
0.27
0.74
0.51
5
4.57
Molded Package Thickness
Standoff
A2
A1
A3
CH1
CH2
E
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
4.06
0.89
0.86
1.27
0.25
17.65
17.65
16.66
16.66
16.00
16.00
0.33
0.81
0.53
10
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
D
Molded Package Width
Molded Package Length
Footprint Width
E1
D1
E2
D2
c
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B1
B
α
β
0
5
10
0
5
10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
DS30569A-page 144
Preliminary
1999 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
