PIC16C62X
12.2
DC CHARACTERISTICS:
PIC16LC62X-04 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature –40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial and
–40˚C ≤ TA ≤ +125˚C for extended
Operating voltage VDD range as described in DC spec Table 12-1 and Table 12-2
Param
No.
Sym
Characteristic
Min Typ† Max Units
Conditions
D001
D002
D003
D004
VDD
Supply Voltage
3.0
2.5
-
6.0
6.0
V
V
V
XT and RC osc configuration
LP osc configuration
VDR
RAM Data Retention
Voltage (Note 1)
–
1.5*
VSS
–
–
–
–
Device in SLEEP mode
VPOR
SVDD
VDD start voltage to
ensure Power-on Reset
–
See section on Power-on Reset for
details
VDD rise rate to ensure
Power-on Reset
0.05*
V/ms See section on Power-on Reset for
details
D005
D010
VBOR
IDD
Brown-out Detect Voltage
Supply Current (Note 2)
3.7
–
4.0
1.4
4.3
2.5
V
BOREN configuration bit is cleared
mA XT and RC osc configuration
FOSC = 2.0 MHz, VDD = 3.0V, WDT dis-
abled (Note 4)
D010A
–
26
53
µA
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT dis-
abled
D020
D023
IPD
Power Down Current (Note 3)
–
0.7
2
µA
VDD=3.0V, WDT disabled
∆IWDT
∆IBOR
WDT Current (Note 5)
Brown-out Reset Current
(Note 5)
–
–
6.0
350
15
425
µA
µA
VDD=3.0V
BOR enabled, VDD = 5.0V
∆ICOMP
Comparator Current for each
Comparator (Note 5)
VREF Current (Note 5)
–
–
100
300
µA
µA
VDD = 3.0V
VDD = 3.0V
∆IVREF
*
These parameters are characterized but not tested.
†
Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated.These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD to VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2Rext (mA) with Rext in kΩ.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
DS30235G-page 82
Preliminary
1998 Microchip Technology Inc.