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PIC16F876-20I/SO 参数 Datasheet PDF下载

PIC16F876-20I/SO图片预览
型号: PIC16F876-20I/SO
PDF下载: 下载PDF文件 查看货源
内容描述: 40分之28引脚8位CMOS闪存微控制器 [28/40-pin 8-Bit CMOS FLASH Microcontrollers]
分类和应用: 闪存微控制器和处理器外围集成电路光电二极管PC时钟
文件页数/大小: 200 页 / 3544 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC16F87X  
17.7  
K04-048 44-Lead Plastic Leaded Chip Carrier (L) – Square  
E1  
E
# leads = n1  
D1  
D
n 1 2  
α
A3  
CH2 x 45°  
CH1 x 45°  
R1  
c
L
A
35°  
A1  
B1  
B
R2  
β
A2  
p
E2  
D2  
Units  
Dimension Limits  
Number of Pins  
INCHES*  
NOM  
44  
MILLIMETERS  
MIN  
MAX  
MIN  
NOM  
44  
MAX  
n
Pitch  
p
A
0.050  
0.173  
0.103  
0.023  
0.029  
0.045  
0.005  
0.690  
0.690  
0.653  
0.653  
0.620  
0.620  
11  
0.010  
0.029  
0.018  
0.058  
0.005  
0.025  
5
1.27  
Overall Pack. Height  
Shoulder Height  
Standoff  
0.165  
0.180  
4.19  
2.41  
0.38  
0.61  
1.02  
0.00  
17.40  
17.40  
16.51  
16.51  
15.49  
15.49  
4.38  
2.60  
0.57  
0.74  
1.14  
0.13  
17.53  
17.53  
16.59  
16.59  
15.75  
15.75  
11  
0.25  
0.74  
0.46  
1.46  
0.13  
0.64  
5
4.57  
2.79  
0.76  
0.86  
1.27  
A1  
A2  
A3  
CH1  
CH2  
E1  
D1  
E
D
E2  
D2  
n1  
c
B1  
B
0.095  
0.015  
0.024  
0.040  
0.000  
0.685  
0.685  
0.650  
0.650  
0.610  
0.610  
0.110  
0.030  
0.034  
0.050  
0.010  
0.695  
0.695  
0.656  
0.656  
0.630  
0.630  
Side 1 Chamfer Dim.  
Corner Chamfer (1)  
Corner Chamfer (other)  
Overall Pack. Width  
Overall Pack. Length  
Molded Pack. Width  
Molded Pack. Length  
Footprint Width  
Footprint Length  
Pins along Width  
Lead Thickness  
Upper Lead Width  
Lower Lead Width  
Upper Lead Length  
Shoulder Inside Radius  
J-Bend Inside Radius  
Mold Draft Angle Top  
0.25  
17.65  
17.65  
16.66  
16.66  
16.00  
16.00  
0.008  
0.026  
0.015  
0.050  
0.003  
0.015  
0
0.012  
0.032  
0.021  
0.065  
0.010  
0.035  
10  
0.20  
0.66  
0.38  
1.27  
0.08  
0.38  
0
0.30  
0.81  
0.53  
1.65  
0.25  
0.89  
10  
L
R1  
R2  
α
Mold Draft Angle Bottom  
β
0
5
10  
0
5
10  
*
Controlling Parameter.  
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”  
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”  
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not  
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions “D” or “E.”  
JEDEC equivalent:MO-047 AC  
DS30292B-page 182  
1999 Microchip Technology Inc.