PIC16CE62X
14.1
Package Marking Information
18-Lead PDIP
Example
XXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXX
PIC16CE625
-04I/P423
9807CDK
AABBCDE
18-Lead SOIC (.300")
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
PIC16CE625
-04I/S0218
AABBCDE
9807 CDK
18-Lead CERDIP Windowed
Example
XXXXXXXX
XXXXXXXX
AABBCDE
16CE625
/JW
9807 CBA
20-Lead SSOP
Example
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
PIC16CE625
-04I/218
9807 CBP
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
BB
C
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D
E
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
1998 Microchip Technology Inc.
Preliminary
DS40182A-page 97
MICROCHIP [ MICROCHIP ]
