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PIC16F76-I/SOD23G 参数 Datasheet PDF下载

PIC16F76-I/SOD23G图片预览
型号: PIC16F76-I/SOD23G
PDF下载: 下载PDF文件 查看货源
内容描述: [8-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, MS-013, SO-28]
分类和应用: 时钟光电二极管外围集成电路
文件页数/大小: 174 页 / 4049 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC16F7X  
15.1 DC Characteristics: PIC16F73/74/76/77 (Industrial, Extended)  
PIC16LF73/74/76/77 (Industrial)  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
PIC16LF73/74/76/77  
(Industrial)  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
-40°C TA +125°C for extended  
PIC16F73/74/76/77  
(Industrial, Extended)  
Param  
Sym  
No.  
Characteristic  
Min Typ† Max Units  
Conditions  
VDD  
Supply Voltage  
PIC16LF7X 2.5  
D001  
5.5  
5.5  
5.5  
V
V
V
A/D in use, -40°C to +85°C  
A/D in use, 0°C to +85°C  
A/D not used, -40°C to +85°C  
2.2  
2.0  
D001  
D001A  
PIC16F7X 4.0  
-
-
5.5  
5.5  
V
V
All configurations  
BOR enabled (Note 7)  
VBOR*  
D002* VDR  
RAM Data Retention  
Voltage (Note 1)  
-
-
1.5  
-
V
D003 VPOR VDD Start Voltage to  
ensure internal Power-on  
Reset signal  
VSS  
-
V
See section on Power-on Reset for details  
D004* SVDD VDD Rise Rate to ensure  
internal Power-on Reset  
signal  
0.05  
-
-
V/ms See section on Power-on Reset for details  
D005 VBOR Brown-out Reset Voltage 3.65  
4.0 4.35  
V
BODEN bit in configuration word enabled  
Legend: Shading of rows is to assist in readability of of the table.  
*
These parameters are characterized but not tested.  
Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance  
only and are not tested.  
Note 1: This is the limit to which VDD can be lowered without losing RAM data.  
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin  
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an  
impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from-rail to-rail; all I/O pins tri-stated, pulled to VDD  
MCLR = VDD; WDT enabled/disabled as specified.  
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is  
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.  
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-  
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.  
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from character-  
ization and is for design guidance only. This is not tested.  
6: The current is the additional current consumed when this peripheral is enabled. This current should be  
added to the base IDD or IPD measurement.  
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.  
2002 Microchip Technology Inc.  
DS30325B-page 121  
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