PIC16C63A/65B/73B/74B
18.9 44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead
Form (MQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
c
n
°
CH x 45
α
A1
A
φ
β
(F)
L
A2
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
44
MAX
n
p
Number of Pins
Pitch
44
.031
11
0.80
11
Pins per Side
Overall Height
n1
A
.079
.077
.002
.029
.086
.080
.006
.035
.063
3.5
.093
2.00
1.95
2.18
2.03
0.15
0.88
1.60
3.5
2.35
Molded Package Thickness
Standoff
A2
A1
L
(F)
φ
.083
.010
.041
2.10
0.25
1.03
§
0.05
0.73
Foot Length
Footprint (Reference)
Foot Angle
0
.510
.510
.390
.390
.005
.012
.025
5
7
.530
.530
.398
.398
.009
.018
.045
15
0
12.95
12.95
9.90
9.90
0.13
0.30
0.64
5
7
13.45
13.45
10.10
10.10
0.23
0.45
1.14
15
Overall Width
E
D
.520
.520
.394
.394
.007
.015
.035
10
13.20
13.20
10.00
10.00
0.18
0.38
0.89
10
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
E1
D1
c
Lead Width
B
CH
α
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
DS30605C-page 162
2000 Microchip Technology Inc.