PIC12F629/675
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
E
p
B
E1
n
L
R
D1
D
D2
PIN 1
EXPOSED
METAL
PADS
ID
1
2
E2
BOTTOM VIEW
TOP VIEW
α
A2
A3
A
A1
Units
Dimension Limits
INCHES
MILLIMETERS*
MIN
NOM
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050 BSC
1.27 BSC
0.85
Overall Height
A
.033
.039
1.00
Molded Package Thickness
Standoff
A2
A1
A3
.026
.0004
.031
.002
0.65
0.80
0.05
.000
.152
0.00
0.01
0.20 REF.
Base Thickness
Overall Length
.008 REF.
.194 BSC
.184 BSC
.158
E
E1
E2
D
4.92 BSC
4.67 BSC
Molded Package Length
Exposed Pad Length
Overall Width
.163
3.85
4.00
4.15
.236 BSC
.226 BSC
.091
5.99 BSC
5.74 BSC
Molded Package Width
Exposed Pad Width
Lead Width
D1
D2
B
.085
.014
.020
.097
.019
.030
2.16
0.35
0.50
2.31
2.46
0.47
0.75
.016
0.40
0.60
.356
Lead Length
L
.024
Tie Bar Width
R
.014
α
Mold Draft Angle Top
12
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
DS41190C-page 118
2003 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
