PIC12C5XX
15.0
15.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXCDE
AABB
Example
12C508A
04I/PSAZ
9825
8-Lead SOIC (150 mil)
XXXXXXX
AABB
8-Lead SOIC (208 mil)
XXXXXXX
XXXXXXX
AABBCDE
Example
C508A
9825
Example
12C508A
04I/SM
9824SAZ
8-Lead Windowed Ceramic Side Brazed (300 mil)
XXX
Example
JW
XXXXXX
12C508A
Legend:
MM...M
XX...X
AA
BB
C
D
E
Note:
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
©
1999 Microchip Technology Inc.
DS40139E-page 99
MICROCHIP [ MICROCHIP TECHNOLOGY ]
