PIC12F629/675
APPENDIX A: DATA SHEET
REVISION HISTORY
APPENDIX B: DEVICE
DIFFERENCES
The differences between the PIC12F629/675 devices
listed in this data sheet are shown in Table B-1.
Revision A
This is a new data sheet.
TABLE B-1:
Feature
A/D
DEVICE DIFFERENCES
PIC12F629 PIC12F675
Revision B
Added characterization graphs.
Updated specifications.
No
Yes
Added notes to indicate Microchip programmers
maintain all Calibration bits to factory settings and the
PIC12F675 ANSEL register must be initialized to
configure pins as digital I/O.
Updated MLF-S package name to DFN-S.
Revision C
Revision D (01/2007)
Updated Package Drawings; Replace PICmicro with
PIC; Revised Product ID example (b).
Revision E (03/2007)
Replaced Package Drawings (Rev. AM); Replaced
Development Support Section.
Revision F (09/2009)
Updated Registers to new format; Added information to
the “Package Marking Information” (8-Lead DFN) and
“Package Details” sections (8-Lead Dual Flat, No Lead
Package (MD) 4X4X0.9 mm Body (DFN)); Added Land
Patterns for SOIC (SN) and DFN-S (MF) packages;
Updated Register 3-2; Added MD Package to the
Product identification System chapter; Other minor
corrections.
Revision G (03/2010)
Updated the Instruction Set Summary section, adding
pages 76 and 77.
2010 Microchip Technology Inc.
DS41190G-page 127