Micrel, Inc.
MIC2950/2951
Parameter
Condition
Min
2.0
2.0
2.0
2.0
Typ
Max
Units
Shutdown Input Logic Voltage
MIC295x-02/-05 (±0.5%)
Low
High
1.3
V
V
V
0.7
0.7
0.7
0.7
MIC295x-03/-06 (±1%)
Low
High
1.3
1.3
1.3
V
V
V
MIC2951-3.3 (±1%)
Low
High
V
V
V
MIC2951-4.8 (±1%)
Low
High
V
V
V
Shutdown Input Current
VSHUTDOWN = 2.4V
VSHUTDOWN = 30V
Note 7
30
450
3
50
100
µA
µA
600
750
µA
µA
Regulator Output Current
in Shutdown
10
20
µA
µA
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. Devices are ESD sensitive. Handling precautions are recommended.
4. The junction-to-ambient thermal resistance of the TO-92 package is 180°C/W with 0.4” leads and 160°C/W with 0.25” leads to a PC board. The
thermal resistance of the 8-pin DIP package is 105°C/W junction-to-ambient when soldered directly to a PC board. Junction-to-ambient thermal
resistance for the SOIC (M) package is 160°C/W. Junction-to-ambient thermal resistance for the MM8™ (MM) is 250°C/W.
5. The maximum positive supply voltage of 60V must be of limited duration (≤100ms) and duty cycle (≤1%). The maximum continuous supply voltage
is 30V.
6. When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be diode-clamped
to ground.
7.
VSHDN ≥ 2V, VIN ≤ 30V, VOUT = 0, with the FB pin connected to TAP.
8. Additional conditions for 8-pin devices are VFB = 5V, TAP and OUT connected to SNS (VOUT = 5V) and VSHDN ≤ 0.8V.
9. Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
10. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating
effects are covered in the specification for thermal regulation.
11. Line regulation for the MIC2951 is tested at 150°C for IL = 1mA. For IL = 100µA and TJ = 125°C, line regulation is guaranteed by design to 0.2%.
See Typical Performance Characteristics for line regulation versus temperature and load current.
12. Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V
differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over temperature) must be taken into
account.
13. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line
regulation effects. Specifications are for a 50mA load pulse at VIN = 30V (1.25W pulse) for t = 10ms.
14. VREF ≤ VOUT ≤ (VIN – 1 V), 2.3V ≤ VIN ≤ 30V, 100µA < IL ≤ 150mA, TJ ≤ TJMAX
.
15. Comparator thresholds are expressed in terms of a voltage differential at the FB terminal below the nominal reference voltage measured at 6V input.
To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = VOUT /VREF = (R1 + R2)/R2. For example, at a
programmed output voltage of 5V, the error output is guaranteed to go low when the output drops by 95mV x 5V/1.235V = 384mV. Thresholds
remain constant as a percent of VOUT as VOUT is varied, with the dropout warning occurring at typically 5% below nominal, 7.5% guaranteed.
16. Specification for packaged product only.
M9999-021610
February 2010
7
MICROCHIP [ MICROCHIP ]
