MIC29302WU-TR 参数 Datasheet PDF下载

MIC2915X/30X/50X/75X

TEMPERATURE SPECIFICATIONS (Note

1)

Parameters

Temperature Ranges

Storage Temperature Range

Operating Junction Temperature

Lead Temperature

Package Thermal Resistance

Thermal Resistance TO-220

Thermal Resistance TO-263

Thermal Resistance TO-247

Thermal Resistance TO-252

Thermal Resistance TO-252

Note 1:

θ

JC

θ

JC

θ

JC

θ

JC

θ

JA

—

—

—

—

—

2

2

1.5

3

56

—

—

—

—

—

°C/W

°C/W

°C/W

°C/W

°C/W

—

—

—

—

—

T

S

T

J

—

–65

–40

—

—

—

—

+150

+125

+260

°C

°C

°C

—

—

Soldering, 5 sec.

Sym.

Min.

Typ.

Max.

Units

Conditions

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., T

A

, T

J

,



JA

). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

DS20005685A-page 8

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2016 Microchip Technology Inc.