MCP9700/9700A and MCP9701/9701A
Note:
Unless otherwise indicated,
MCP9700/9700A:
V
DD
= 2.3V to 5.5V;
MCP9701/9701A:
V
DD
= 3.1V to 5.5V; GND
= Ground, C
bypass
= 0.1 µF.
1.6
1.4
1.2
V
OUT
(V)
V
OUT
(V)
T
A
= 26°C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
MCP9700
MCP9700A
MCP9701
MCP9701A
1.0
0.8
0.6
0.4
0.2
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
DD
(V)
100
125
T
A
(°C)
FIGURE 2-13:
Supply.
12
10
8
6
V
OUT
(V)
4
2
0
0.0
0.1
0.2
Output Voltage vs. Power
FIGURE 2-16:
Temperature.
Output Voltage vs. Ambient
2.5
I
DD
(mA)
V
DD_STEP
= 5V
T
A
= 26°C
I
DD
3.0
2.5
2.0
1.5
V
OUT
(V)
1.0
0.5
0.0
V
OUT
I
DD
1.7
0.8
0.0
18.0
6.0
-6.0
-18.0
-30.0
-42.0
V
OUT
-0.8
-1.7
-2.5
0.3
0.4
0.5
0.6
0.7
0.8
0.9
-0.1
1.0
Time (ms)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (ms)
FIGURE 2-14:
step V
DD
.
130
105
T
A
(°C)
80
55
30
-2
0
2
4
Output vs. Settling Time to
FIGURE 2-17:
Ramp V
DD
.
1000
Output Impedance ( )
V
DD
= 5.0V
I
OUT
= 100 µA
T
A
= 26°C
Output vs. Settling Time to
SC70-5
1 in. x 1 in. Copper Clad
PCB
Leaded, without PCB
SC70-5
TO92-3
100
10
1
6
8 10
Time (s)
12
14
16
18
0.1
0.1
1
1
10
100
1K
10
100
1000
Frequency (Hz)
10K
100K
10000 100000
FIGURE 2-15:
Fluid Bath).
Thermal Response (Air to
FIGURE 2-18:
Frequency.
Output Impedance vs.
DS21942C-page 6
©
2006 Microchip Technology Inc.
I
DD
(µA)
V
DD_RAMP
= 5V/ms
T
A
= 26°C
30.0
MICROCHIP [ MICROCHIP TECHNOLOGY ]
