MCP73831/2
8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
D
b
p
n
L
K
E
E2
EXPOSED
METAL
PAD
(NOTE 2)
2
1
PIN 1
ID INDEX
AREA
DETAIL
D2
ALTERNATE
CONTACT
(
NOTE 1)
BOTTOM VIEW
CONFIGURATION
TOP VIEW
EXPOSED
TIE BAR
A
A1
(
NOTE 3)
A3
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
MAX
n
e
Number of Pins
Pitch
8
8
.020 BSC
.035
0.50 BSC
Overall Height
Standoff
A
A1
A3
D
.031
.000
.039
0.80
0.90
0.02
0.20 REF.
1.00
.001
.008 REF.
.002
0.00
0.05
Contact Thickness
Overall Length
Overall Width
.079 BSC
.118 BSC
2.00 BSC
3.00 BSC
E
Exposed Pad Length
Exposed Pad Width
Contact Length §
D2
E2
L
.051
.059
.012
.008
.008
–
–
.069
.075
.020
1.30**
1.50**
0.30
–
–
1.75
1.90
0.50
.016
0.40
Contact-to-Exposed Pad
Contact Width
§
K
–
–
0.20
–
–
b
.010
.012
0.20
0.25
0.30
*
Controlling Parameter
** Not within JEDEC parameters
Significant Characteristic
Notes:
§
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent MO-229 VCED-2
Revised 09-12-05
DWG No. C04-123
DS21984B-page 16
© 2006 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
