MCP6541/1R/1U/2/3/4
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
p
D
2
1
n
B
α
A
c
φ
β
L
A1
A2
Units
INCHES
NOM
MILLIMETERS
NOM
14
*
Dimension Limits
MIN
MAX
MIN
MAX
n
p
Number of Pins
Pitch
14
.026 BSC
.041
0.65 BSC
1.05
Overall Height
A
A2
A1
E
.039
.033
.002
.246
.169
.193
.020
.043
1.00
1.10
Molded Package Thickness
Standoff
.035
.004
.251
.173
.197
.024
.037
.006
.256
.177
.201
.028
0.85
0.05
6.25
4.30
4.90
0.50
0.90
0.95
0.15
6.50
4.50
5.10
0.70
0.10
Overall Width
6.38
Molded Package Width
Molded Package Length
Foot Length
E1
D
4.40
5.00
L
0.60
φ
Foot Angle
0°
4°
8°
0°
4°
0.15
0.25
12° REF
12° REF
8°
c
Lead Thickness
.004
.007
.006
.010
.008
.012
0.09
0.19
0.20
0.30
Lead Width
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
12° REF
12° REF
β
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold fla sh or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tole rance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-153 AB-1
Drawing No. C04-087
Revised: 08-17-05
DS21696E-page 28
© 2006 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
