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MCP6542-I/SN 参数 Datasheet PDF下载

MCP6542-I/SN图片预览
型号: MCP6542-I/SN
PDF下载: 下载PDF文件 查看货源
内容描述: 推挽输出亚微安比较 [Push-Pull Output Sub-Microamp Comparators]
分类和应用: 比较器放大器放大器电路光电二极管PC
文件页数/大小: 34 页 / 1169 K
品牌: MICROCHIP [ MICROCHIP ]
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MCP6541/1R/1U/2/3/4  
the resistors R1 and R2 limit the possible current drawn  
out of the input pin. Diodes D1 and D2 prevent the input  
4.0  
APPLICATIONS INFORMATION  
The MCP6541/2/3/4 family of push-pull output compar-  
ators are fabricated on Microchip’s state-of-the-art  
CMOS process. They are suitable for a wide range of  
applications requiring very low power consumption.  
pin (VIN+ and VIN–) from going too far above VDD  
.
When implemented as shown, resistors R1 and R2 also  
limit the current through D1 and D2.  
VDD  
4.1  
Comparator Inputs  
4.1.1  
PHASE REVERSAL  
D1  
The MCP6541/1R/1U/2/3/4 comparator family uses  
CMOS transistors at the input. They are designed to  
prevent phase inversion when the input pins exceed  
the supply voltages. Figure 2-3 shows an input voltage  
exceeding both supplies with no resulting phase  
inversion.  
+
V1  
R1  
VOUT  
MCP6G0X  
D2  
V2  
R2  
R3  
4.1.2  
INPUT VOLTAGE AND CURRENT  
LIMITS  
VSS – (minimum expected V1)  
2 mA  
R1 ≥  
R2 ≥  
The ESD protection on the inputs can be depicted as  
shown in Figure 4-1. This structure was chosen to pro-  
tect the input transistors, and to minimize input bias  
current (IB). The input ESD diodes clamp the inputs  
when they try to go more than one diode drop below  
VSS. They also clamp any voltages that go too far  
above VDD; their breakdown voltage is high enough to  
allow normal operation, and low enough to bypass ESD  
events within the specified limits.  
VSS – (minimum expected V2)  
2 mA  
FIGURE 4-2:  
Protecting the Analog Inputs.  
It is also possible to connect the diodes to the left of the  
resistors R1 and R2. In this case, the currents through  
the diodes D1 and D2 need to be limited by some other  
mechanism. The resistor then serves as in-rush current  
limiter; the DC current into the input pins (VIN+ and  
VIN–) should be very small.  
Bond  
VDD  
Pad  
A significant amount of current can flow out of the  
inputs when the common mode voltage (VCM) is below  
ground (VSS); see Figure 2-37. Applications that are  
high impedance may need to limit the useable voltage  
range.  
Bond  
Pad  
Bond  
Pad  
Input  
Stage  
VIN+  
VIN–  
4.1.3  
NORMAL OPERATION  
Bond  
Pad  
The input stage of this family of devices uses two  
differential input stages in parallel: one operates at low  
input voltages and the other at high input voltages. With  
this topology, the input voltage is 0.3V above VDD and  
0.3V below VSS. Therefore, the input offset voltage is  
measured at both VSS - 0.3V and VDD + 0.3V to ensure  
proper operation.  
VSS  
FIGURE 4-1:  
Structures.  
Simplified Analog Input ESD  
In order to prevent damage and/or improper operation  
of these amplifiers, the circuits they are in must limit the  
currents (and voltages) at the VIN+ and VIN– pins (see  
Absolute Maximum Ratings † at the beginning of  
Section 1.0 “Electrical Characteristics”). Figure 4-3  
shows the recommended approach to protecting these  
inputs. The internal ESD diodes prevent the input pins  
(VIN+ and VIN–) from going too far below ground, and  
The MCP6541/1R/1U/2/3/4 family has internally-set  
hysteresis that is small enough to maintain input offset  
accuracy (<7 mV) and large enough to eliminate output  
chattering caused by the comparator’s own input noise  
voltage (200 µVp-p). Figure 4-3 depicts this behavior.  
DS21696E-page 14  
© 2006 Microchip Technology Inc.