MCP6031/2/3/4
APPENDIX A: REVISION HISTORY
Revision B (March 2008)
The following is the list of modifications:
1. Added SOT-23-5 and 2x3 DFN packages.
2. Added test circuits.
3. Corrected VOS temperature drift information.
4. Added Section 4.9.3.
5. Updated Package Marking Information.
6. Updated all package outline drawings and
added package outline drawings for SOT-23-5
and 2x3 DFN packages.
7. Added Landing Pattern drawings for 2x3 DFN
and 8-lead SOIC packages.
8. Updated information in Product Identification
System for SOT-23-5 and 2x3 DFN packages.
Revision A (March 2007)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
DS22041B-page 29
MICROCHIP [ MICROCHIP ]
