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MCP6031T-E/OT 参数 Datasheet PDF下载

MCP6031T-E/OT图片预览
型号: MCP6031T-E/OT
PDF下载: 下载PDF文件 查看货源
内容描述: 0.9 μA ,高精度运算放大器 [0.9 μA, High Precision Op Amps]
分类和应用: 运算放大器放大器电路光电二极管PC
文件页数/大小: 34 页 / 636 K
品牌: MICROCHIP [ MICROCHIP ]
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MCP6031/2/3/4  
4.6  
Supply Bypass  
With this family of operational amplifiers, the power  
supply pin (VDD for single-supply) should have a local  
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm  
for good high frequency performance. It can use a bulk  
capacitor (i.e., 1 µF or larger) within 100 mm to provide  
large, slow currents. This bulk capacitor can be shared  
with other analog parts.  
Guard Ring  
VIN– VIN+  
VSS  
4.7  
Unused Op Amps  
FIGURE 4-6:  
for Inverting Gain.  
Example Guard Ring Layout  
An unused op amp in a quad package (MCP6034)  
should be configured as shown in Figure 4-5. These  
circuits prevent the output from toggling and causing  
crosstalk. Circuits A sets the op amp at its minimum  
noise gain. The resistor divider produces any desired  
reference voltage within the output voltage range of the  
op amp; the op amp buffers that reference voltage.  
Circuit B uses the minimum number of components  
and operates as a comparator, but it may draw more  
current.  
1. Non-inverting Gain and Unity-Gain Buffer:  
a. Connect the non-inverting pin (VIN+) to the  
input with a wire that does not touch the  
PCB surface.  
b. Connect the guard ring to the inverting input  
pin (VIN–). This biases the guard ring to the  
common mode input voltage.  
2. Inverting Gain and Transimpedance Gain Ampli-  
fiers (convert current to voltage, such as photo  
detectors):  
¼ MCP6034 (A)  
VDD  
¼ MCP6034 (B)  
a. Connect the guard ring to the non-inverting  
input pin (VIN+). This biases the guard ring  
to the same reference voltage as the op  
amp (e.g., VDD/2 or ground).  
VDD  
VDD  
R1  
R2  
b. Connect the inverting pin (VIN–) to the input  
with a wire that does not touch the PCB  
surface.  
VREF  
R2  
------------------  
VREF = VDD  
R1 + R2  
FIGURE 4-5:  
Unused Op Amps.  
4.8  
PCB Surface Leakage  
In applications where low input bias current is critical,  
Printed Circuit Board (PCB) surface leakage effects  
need to be considered. Surface leakage is caused by  
humidity, dust or other contamination on the board.  
Under low humidity conditions, a typical resistance  
between nearby traces is 1012Ω. A 5V difference would  
cause 5 pA of current to flow; which is greater than the  
MCP6031/2/3/4 family’s bias current at +25°C  
(±1.0 pA, typical).  
The easiest way to reduce surface leakage is to use a  
guard ring around sensitive pins (or traces). The guard  
ring is biased at the same voltage as the sensitive pin.  
An example of this type of layout is shown in  
Figure 4-6.  
DS22041B-page 16  
© 2008 Microchip Technology Inc.  
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