MCP6001/2/4
5-Lead Plastic Package (SC-70)
E
E1
D
p
B
n
1
Q1
A2
A
c
A1
L
Units
INCHES
NOM
5
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
5
MAX
n
p
Number of Pins
Pitch
.026 (BSC)
0.65 (BSC)
Overall Height
A
.031
.031
.000
.071
.045
.071
.004
.004
.004
.006
.043
0.80
1.10
Molded Package Thickness
Standoff
A2
A1
E
.039
.004
.094
.053
.087
.012
.016
.007
.012
0.80
0.00
1.80
1.15
1.80
0.10
0.10
0.10
0.15
1.00
0.10
2.40
1.35
2.20
0.30
0.40
0.18
0.30
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
Q1
c
Top of Molded Pkg to Lead Shoulder
Lead Thickness
Lead Width
B
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
© 2005 Microchip Technology Inc.
DS21733F-page 15
MICROCHIP [ MICROCHIP ]
