MCP413X/415X/423X/425X
APPENDIX A: REVISION HISTORY
APPENDIX B: MIGRATING FROM
THE MCP41XXX AND
Revision B (December 2008)
MCP42XXX DEVICES
The following is the list of modifications:
This is intended to give an overview of some of the
differences to be aware of when migrating from the
MCP41XXX and MCP42XXX devices.
1. Updated IPU specifications to specify test
conditions and new limit.
2. Updated DFN package in “Package Types (top
view)”, including Exposed Thermal Pad sample
(EP).
B.1
MCP41XXX to MCP41XX
Differences
3. Added new descriptions in Section 3.0 “Pin
Descriptions”.
Here are some of the differences to be aware of:
1. SI pin is now SDI/SDO pin, and the contents of
the device memory can be read.
4. Added new Development Tool support items.
5. Updated Package Outline section.
2. Need to address the Terminal Connect Feature
(TCON register) of MCP41XX.
Revision A (September 2007)
3. MCP41XX supports software Shutdown mode.
4. New 5 kΩ version.
• Original Release of this Document.
5. MCP41XX have 7-bit resolution options.
6. Alternate pinout versions (for Rheostat
configuration).
7. Verify device’s electrical specifications.
8. Interface signals are now high voltage tolerant.
9. Interface signals now have internal pull-up
resistors.
B.2
MCP42XXX to MCP42XX
Differences
Here are some of the differences to be aware of:
1. Daisy chaining of devices is no longer
supported.
2. SDO pin allows contents of device memory to be
read.
3. Need to address the Terminal Connect Feature
(TCON register) of MCP42XX.
4. MCP42XX supports software Shutdown mode.
5. New 5 kΩ version.
6. MCP42XX have 7-bit resolution options.
7. Alternate package/pinout versions (for Rheostat
configuration).
8. Verify device’s electrical specifications.
9. Interface signals are now high voltage tolerant
10. Interface signals now have internal pull-up
resistors.
© 2008 Microchip Technology Inc.
DS22060B-page 83
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