MCP413X/415X/423X/425X
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in
Additional descriptions of the device pins follows.
TABLE 3-1:
PINOUT DESCRIPTION FOR THE MCP413X/415X/423X/425X
Pin
Single
Rheo Pot
8L
1
2
3
—
4
—
—
—
—
5
6
—
7
8
—
9
Legend:
(1)
Dual
Rheo
10L
1
2
3
—
4
5
6
—
—
7
8
—
9
10
—
11
14L
1
2
3
—
4
5
6
7
8
9
10
12
13
14
11
—
Pot
16L
16
1
2
—
3, 4
5
6
7
8
9
10
13
14
15
17
CS
SCK
SDI
SDI/SDO
V
SS
P1B
P1W
P1A
P0A
P0W
P0B
SHDN
SDO
V
DD
EP
I
I
I
I/O
—
A
A
A
A
A
A
I
O
—
—
—
HV w/ST
HV w/ST
HV w/ST
HV w/ST
P
Analog
Analog
Analog
Analog
Analog
Analog
HV w/ST
O
P
—
—
Symbol
I/O
Buffer
Type
Weak
Pull-up/
down
(2)
Standard Function
8L
1
2
—
3
4
—
—
—
5
6
7
—
—
8
—
9
“smart”
“smart”
“smart”
“smart”
—
No
No
No
No
No
No
“smart”
No
—
—
—
SPI Chip Select Input
SPI Clock Input
SPI Serial Data Input
SPI Serial Data Input/Output
Ground
Potentiometer 1 Terminal B
Potentiometer 1 Wiper Terminal
Potentiometer 1 Terminal A
Potentiometer 0 Terminal A
Potentiometer 0 Wiper Terminal
Potentiometer 0 Terminal B
Hardware Shutdown
SPI Serial Data Out
Positive Power Supply Input
No Connection
Exposed Pad
11,12 NC
HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals)
I = digital input (high Z)
O = digital output
I/O = Input / Output
P = Power
The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and
shutdown current.
The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s V
SS
pin.
Note 1:
2:
3:
4:
©
2008 Microchip Technology Inc.
DS22060B-page 31