MCP2515
20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
p
E1
D
B
2
1
n
α
A
c
φ
A2
β
L
A1
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
20
MAX
n
p
Number of Pins
Pitch
20
.026
0.65
Overall Height
A
.043
1.10
Molded Package Thickness
Standoff
A2
A1
E
.033
.002
.246
.169
.252
.020
0
.035
.004
.251
.173
.256
.024
4
.037
.006
.256
.177
.260
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
6.50
0.60
4
0.95
0.15
6.50
4.50
6.60
0.70
8
§
Overall Width
6.25
4.30
6.40
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-088
DS21801D-page 78
Preliminary
© 2005 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
