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MCP2200-IMQ 参数 Datasheet PDF下载

MCP2200-IMQ图片预览
型号: MCP2200-IMQ
PDF下载: 下载PDF文件 查看货源
内容描述: USB 2.0 UART协议转换器,具有GPIO [USB 2.0 to UART Protocol Converter with GPIO]
分类和应用: 转换器
文件页数/大小: 44 页 / 503 K
品牌: MICROCHIP [ MICROCHIP TECHNOLOGY ]
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MCP2200
USB 2.0 to UART Protocol Converter with GPIO
Features
Universal Serial Bus (USB)
• Supports full-speed USB (12 Mb/s)
• Implements USB protocol composite device:
- Communication Device Class (CDC) for
communications and configuration
- Human Interface Device (HID) for I/O control
• 128-byte buffer to handle data throughput at any
UART baud rate:
- 64-byte transmit
- 64-byte receive
• Fully configurable VID and PID assignments, and
string descriptors
• Bus powered or self-powered
• USB 2.0 Compliant: TID 40001150
USB Driver and Software Support
• Uses standard Windows
®
drivers for Virtual Com
Port (VCP): Windows XP (SP2 or later), Vista, 7
• Configuration utility for initial configuration
Universal Asynchronous Receiver/Transmitter
(UART)
• Responds to
SET LINE CODING
commands to
dynamically change baud rates
• Supports baud rates: 300-1000k
• Hardware flow control
• UART signal polarity option
General Purpose Input/Output (GPIO) Pins
• Eight general purpose I/O pins
EEPROM
• 256 bytes of user EEPROM
Other
• USB activity LED outputs (TxLED and RxLED)
• SSPND output pin
• USBCFG output pin (indicates when the enumer-
ation is completed)
• Operating voltage: 3.0-5.5V
• Oscillator input: 12 MHz
• ESD protection: > 4 kV HBM
• Industrial (I) Operating Temperature: -40°C to
+85°C
RST 1
GP7/TxLED 2
GP6/RxLED 3
GP5 4
GP4 5
6
GP3
7
TX
8
RTS
9 10
RX
CTS
DS22228B-page 1
EP
21
Package Types
The device will be offered in the following packages:
• 20-lead QFN (5 x 5 mm)
• 20-lead SOIC
• 20-lead SSOP
MCP2200
SOIC, SSOP
V
DD
1
OSC1 2
OSC2 3
RST 4
GP7/TxLED 5
GP6/RxLED 6
GP5 7
GP4 8
GP3 9
TX 10
20 V
SS
19 D+
18 D-
17 V
USB
16 GP0/SSPND
15 GP1/USBCFG
14 GP2
13 CTS
12 RX
11 RTS
MCP2200
5x5 QFN*
OSC2
OSC1
V
DD
V
SS
D+
15 D-
14 V
USB
13 GP0/SSPND
12 GP1/USBCFG
11 GP2
20 19 18 17 16
* Includes Exposed Thermal Pad (EP); see
2011 Microchip Technology Inc.