MCP2210
TABLE 4-2:
THERMAL CONSIDERATIONS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C TA +85C (I-Temp)
Param
No.
Sym
Characteristic
Typ
Units
Conditions
TH01
θJA
Thermal Resistance Junction to
Ambient
85.2
108.1
36.1
24
C/W 20-pin SOIC package
C/W 20-pin SSOP package
C/W 20-pin QFN 5x5 mm package
C/W 20-pin SOIC package
C/W 20-pin SSOP package
C/W 20-pin QFN 5x5 mm package
C
TH02
θJC
Thermal Resistance Junction to
Case
24
1.7
150
—
TH03
TH04
TJMAX
PD
Maximum Junction Temperature
Power Dissipation
W
W
W
PD = PINTERNAL + PI/O
(1)
TH05 PINTERNAL Internal Power Dissipation
—
PINTERNAL = IDD x VDD
TH06
PI/O
I/O Power Dissipation
—
PI/O = (IOL * VOL) + (IOH * (VDD –
VOH))
(2,3)
TH07
PDER
Derated Power
—
W
PDER = PDMAX (TJ - TA)/θJA
Note 1: IDD is the current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.
2011 Microchip Technology Inc.
DS22288A-page 65
MICROCHIP [ MICROCHIP ]
