MCP2210 BREAKOUT MODULE
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP2210 Breakout Module and covers the
following topics:
• MCP2210 Breakout Module General Description
• What the MCP2210 Breakout Module Kit Includes
1.2
MCP2210 BREAKOUT MODULE GENERAL DESCRIPTION
The MCP2210 Breakout Module is a development and evaluation platform for the
MCP2210 device. The module is comprised of a single DIP form-factor board.
The MCP2210 Breakout Module has the following features:
• SPI bus signals (MOSI, MISO, SCK)
• Nine GP lines, configurable for GPIO, Chip Select or dedicated function operation
• Provides a user selectable (by using a jumper) power supply of 3.3V or 5V (up to
500 mA)
• DIP form-factor (0.6 inches overall row spacing between pins)
• PICkit™ Serial Analyzer header – used for SPI communication only
A Windows
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www.microchip.com.
A DLL package is included to allow development of custom PC applications using the
MCP2210. The DLL package is also available for download on the board web page.
1.3
WHAT THE MCP2210 BREAKOUT MODULE KIT INCLUDES
The MCP2210 Breakout Module Kit includes:
• MCP2210 Breakout Module (ADM00419)
• Mini-USB cable
• Important Information Sheet
©
2012 Microchip Technology Inc.
DS52056A-page 9
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