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DSPIC33FJ128GP306 参数 Datasheet PDF下载

DSPIC33FJ128GP306图片预览
型号: DSPIC33FJ128GP306
PDF下载: 下载PDF文件 查看货源
内容描述: 高性能16位数字信号控制器 [High-Performance,16-Bit Digital Signal Controllers]
分类和应用: 控制器
文件页数/大小: 322 页 / 4629 K
品牌: MICROCHIP [ MICROCHIP TECHNOLOGY ]
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dsPIC33FJXXXGPX06/X08/X10
Communication Modules:
• 3-wire SPI (up to two modules):
- Framing supports I/O interface to simple
codecs
- Supports 8-bit and 16-bit data
- Supports all serial clock formats and
sampling modes
• I
2
C™ (up to two modules):
- Full Multi-Master Slave mode support
- 7-bit and 10-bit addressing
- Bus collision detection and arbitration
- Integrated signal conditioning
- Slave address masking
• UART (up to two modules):
- Interrupt on address bit detect
- Interrupt on UART error
- Wake-up on Start bit from Sleep mode
- 4-character TX and RX FIFO buffers
- LIN bus support
- IrDA
®
encoding and decoding in hardware
- High-Speed Baud mode
- Hardware Flow Control with CTS and RTS
• Data Converter Interface (DCI) module:
- Codec interface
- Supports I
2
S and AC’97 protocols
- Up to 16-bit data words, up to 16 words per
frame
- 4-word deep TX and RX buffers
• Enhanced CAN (ECAN™ module) 2.0B active
(up to 2 modules):
- Up to eight transmit and up to 32 receive buffers
- 16 receive filters and three masks
- Loopback, Listen Only and Listen All
Messages modes for diagnostics and bus
monitoring
- Wake-up on CAN message
- Automatic processing of Remote
Transmission Requests
- FIFO mode using DMA
- DeviceNet™ addressing support
Analog-to-Digital Converters (ADCs):
• Up to two ADC modules in a device
• 10-bit, 1.1 Msps or 12-bit, 500 ksps conversion:
- Two, four or eight simultaneous samples
- Up to 32 input channels with auto-scanning
- Conversion start can be manual or
synchronized with one of four trigger sources
- Conversion possible in Sleep mode
- ±1 LSb max integral nonlinearity
- ±1 LSb max differential nonlinearity
CMOS Flash Technology:
Low-power, high-speed Flash technology
Fully static design
3.3V (±10%) operating voltage
Industrial temperature
Low-power consumption
Packaging:
• 100-pin TQFP (14x14x1 mm and 12x12x1 mm)
• 80-pin TQFP (12x12x1 mm)
• 64-pin TQFP (10x10x1 mm)
Note:
See the device variant tables for exact
peripheral features per device.
DS70286C-page 2
©
2009 Microchip Technology Inc.