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DSPIC33FJ128GP306 参数 Datasheet PDF下载

DSPIC33FJ128GP306图片预览
型号: DSPIC33FJ128GP306
PDF下载: 下载PDF文件 查看货源
内容描述: 闪存编程规范 [Flash Programming Specification]
分类和应用: 闪存
文件页数/大小: 80 页 / 943 K
品牌: MICROCHIP [ MICROCHIP ]
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dsPIC33F/PIC24H PROGRAMMING SPECIFICATION  
8.0  
AC/DC CHARACTERISTICS  
AND TIMING REQUIREMENTS  
Table 8-1 lists AC/DC characteristics and timing  
requirements.  
TABLE 8-1:  
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS  
Standard Operating Conditions  
Operating Temperature: –40°C-85°C. Programming at 25°C is recommended.  
Param  
No.  
Symbol  
Characteristic  
Min  
Max  
Units  
Conditions  
(1)  
D111 VDD  
D112 IPP  
D113 IDDP  
D031 VIL  
D041 VIH  
D080 VOL  
D090 VOH  
D012 CIO  
D013 CF  
Supply Voltage During Programming  
Programming Current on MCLR  
Supply Current During Programming  
Input Low Voltage  
VDDCORE  
3.60  
5
V
μA  
mA  
V
Normal programming  
2
VSS  
0.8 VDD  
0.2 VDD  
VDD  
0.6  
Input High Voltage  
V
Output Low Voltage  
V
IOL = 8.5 mA @ 3.6V  
IOH = -3.0 mA @ 3.6V  
Output High Voltage  
VDD – 0.7  
V
Capacitive Loading on I/O pin (PGD)  
Filter Capacitor Value on VCAP  
Serial Clock (PGC) Period  
50  
pF To meet AC specifications  
1
10  
μF Required for controller core  
P1  
TPGC  
136  
40  
ns  
ns  
ns  
ns  
ns  
ns  
P1A  
P1B  
P2  
TPGCL  
TPGCH  
TSET1  
THLD1  
TDLY1  
Serial Clock (PGC) Low Time  
Serial Clock (PGC) High Time  
Input Data Setup Time to Serial Clock ↓  
Input Data Hold Time from PGC ↓  
40  
15  
P3  
15  
P4  
Delay between 4-bit Command and  
Command Operand  
40  
P4A  
P5  
TDLY1A Delay between Command Operand and  
Next 4-bit Command  
40  
20  
ns  
ns  
TDLY2  
Delay between Last PGC of Command  
to First PGC of Read of Data Word  
P6  
P7  
P8  
TSET2  
THLD2  
TDLY3  
VDD Setup Time to MCLR ↑  
100  
25  
ns  
ms  
μs  
Input Data Hold Time from MCLR ↑  
Delay between Last PGC of Command  
Byte to PGD by Programming Executive  
12  
P9a  
P9b  
TDLY4  
TDLY5  
Programming Executive Command  
Processing Time  
10  
15  
μs  
μs  
Delay between PGD by Programming  
Executive to PGD Released by  
Programming Executive  
23  
P10  
P11  
P12  
P13  
P14  
P15  
P16  
P17  
TDLY6  
TDLY7  
TDLY8  
TDLY9  
TR  
PGC Low Time After Programming  
Bulk Erase Time  
400  
200  
20  
1.5  
ns  
ms  
ms  
ms  
μs  
ns  
s
Page Erase Time  
Row Programming Time  
MCLR Rise Time to Enter ICSP mode  
Data Out Valid from PGC ↑  
1.0  
TVALID  
10  
0
TDLY10 Delay between Last PGC and MCLR ↓  
THLD3 MCLR to VDD ↓  
100  
ns  
Note 1: VDD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be  
within ±0.3V of VDD and VSS, respectively.  
DS70152D-page 74  
Preliminary  
© 2007 Microchip Technology Inc.  
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