11.4 8U2-1 — 8-ball VFBGA
f 0.10
C
d 0.10
(4X)
d 0.08
C
A1 BALL
D
C
A
A1 BALL PAD CORNER
PAD
2
1
CORNER
Øb
A
B
C
D
j n0.15 m C A B
j n0.08 m C
e
E
B
(e1)
A1
A2
A
d
(d1)
TOP VIEW
BOTTOM VIEW
SIDE VIEW
8 SOLDER BALLS
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
NOTE
SYMBOL
A
0.81 0.91 1.00
0.15 0.20 0.25
0.40 0.45 0.50
0.25 0.30 0.35
2.35 BSC
A1
A2
b
D
Notes:
E
e
3.73 BSC
0.75 BSC
1. This drawing is for general
e1
d
d1
0.74 REF
0.75 BSC
0.80 REF
2. Dimension 'b' is measured at the maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
6/11/13
TITLE
GPC
DRAWING NO.
8U2-1
REV.
G
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package
(VFBGA)
GWW
Package Drawing Contact:
packagedrawings@atmel.com
20
AT25128B/256B [DATASHEET]
Atmel-8698E-SEEPROM-AT25128B-256B-Datasheet_012015
MICROCHIP [ MICROCHIP ]
