AT25128B/AT25256B
Packaging Information
f
0.10 C
d
0.10
A
(4X)
d
0.08
Øb
C
A1 BALL
PAD
CORNER
C
D
A1 BALL PAD CORNER
2
1
A
B
C
D
j
j
n 0.15 m C A B
n 0.08 m
C
e
E
B
(e1)
A1
d
A2
A
(d1)
TOP VIEW
BOTTOM VIEW
SIDE VIEW
8 SOLDER BALLS
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
NOTE
SYMBOL
A
0.81 0.91 1.00
0.15 0.20 0.25
0.40 0.45 0.50
0.25 0.30 0.35
2.35 BSC
A1
A2
b
D
Notes:
E
3.73 BSC
1. This drawing is for general
e
0.75 BSC
e1
d
0.74 REF
2. Dimension 'b' is measured at the maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
0.75 BSC
d1
0.80 REF
6/11/13
TITLE
GPC
DRAWING NO.
8U2-1
REV.
G
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package
(VFBGA)
GWW
Note:ꢀ For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
DS20006193A-page 36
© 2019 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
