AT24C02C Ordering Information
Ordering Code
Voltage
Package
8P3
Operation Range
AT24C02C-PUM (Bulk form only)
AT24C02C-SSHM-B(1) (NiPdAu Lead Finish)
AT24C02C-SSHM-T(2) (NiPdAu Lead Finish)
AT24C02C-XHM-T(2) (NiPdAu Lead Finish)
AT24C02C-XHM-B(1) (NiPdAu Lead Finish)
AT24C02C-MAHM-T(2) (NiPdAu Lead Finish)
AT24C02C-STUM-T(2)
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
8S1
8S1
Lead-free/Halogen-free/
Industrial Temperature
8A2
8A2
(–40C to 85C)
8Y6
5TS1
AT24C02C-CUM-T(2)
8U3-1
Industrial Temperature
(–40C to 85C)
AT24C02C-W-11M(3)
1.7V to 5.5V
Die Sale
Notes: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, UDFN, SOT23, and VFBGA = 5K per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial Interface Marketing.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (VFBGA)
8A2
8Y6
5TS1
8U3-1
14
AT24C02C [Preliminary]
8700C–SEEPR–6/10
MICROCHIP [ MICROCHIP ]
