25AA512/25LC512
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
1
2
e
b
α
c
φ
A2
A
β
A1
L
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
Overall Height
A
1.77
1.75
0.05
7.62
5.11
5.13
0.51
0°
–
–
–
–
–
–
–
–
–
–
–
–
2.03
1.98
0.25
8.26
5.38
5.33
0.76
8°
Molded Package Thickness
Standoff §
A2
A1
E
Overall Width
Molded Package Width
Overall Length
E1
D
L
Foot Length
Foot Angle
φ
c
Lead Thickness
Lead Width
0.15
0.36
–
0.25
0.51
15°
b
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
–
15°
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Microchip Technology Drawing C04-056B
DS22021B-page 24
Preliminary
© 2007 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
