24AA512/24LC512/24FC512
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
X
a) 24AA512-I/P:
Industrial Temp.,
Temperature
Range
Package
Lead
Finish
1.8V, PDIP package.
b) 24AA512T-I/SM: Tape and Reel,
Industrial Temp., 1.8V, SOIC
package.
Device:
24AA512:
512 Kbit 1.8V I2C Serial
EEPROM
c) 24AA512-I/ST14: Industrial Temp.,
1.8V, 14-lead, TSSOP package.
24AA512T: 512 Kbit 1.8V I2C Serial
EEPROM (Tape and Reel)
512 Kbit 2.5V I2C Serial
EEPROM
d) 24AA512-I/MF: Industrial Temp.,
1.8V, DFN package.
24LC512:
24LC512T: 512 Kbit 2.5V I2C Serial
EEPROM (Tape and Reel)
24FC512:
e) 24LC512-E/P:
Extended Temp.,
2.5V, PDIP package.
512 Kbit 1 MHz I2C Serial
EEPROM
f) 24LC512-I/SM: Industrial Temp.,
2.5V, SOIC package.
24FC512T: 512 Kbit 1 MHz I2C Serial
EEPROM (Tape and Reel)
g) 24LC512T-I/SM: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
Temperature
Range:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
h) 24LC512-I/MF: Industrial Temp.,
2.5V, DFN package.
i) 24FC512-I/P:
Industrial Temp.,
Package:
P
= Plastic DIP (300 mil body), 8-lead
2.5V, High Speed, PDIP package.
SM = Plastic SOIC (208 mil body), 8-lead
ST14 = Plastic TSSOP (4.4 mm), 14-lead
MF = Micro Lead Frame (6x5 mm body),
8-lead
j) 24FC512-I/SM: Industrial Temp.,
2.5V, High Speed, SOIC package.
k) 24FC512T-I/SM: Tape and Reel,
Industrial Temp., 2.5V, High Speed,
SOIC package
Lead Finish:
Blank= Pb-free – Matte Tin (see Note 1)
G
= Pb-free – Matte Tin only
l) 24LC512T-I/SM: Industrial Temp.,
2.5V, SOIC package, Tape & Reel,
Pb-free
m) 24LC512-I/PG: Industrial Temp.,
2.5V, PDIP package, Pb-free
Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products
manufactured before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please
visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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© 2005 Microchip Technology Inc.
DS21754G-page23
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