FIGURE 8-2:
DEVICE SIDE
0.465
±
0.002
[11.80
±
0.05]
0.285 [7.24] MAX
R. 0.059 [1.50] (4X)
VIA HOLES (8x)
I.D. ¯ 0.026 [0.66]
O.D. ¯ 0.042 [1.06]
0.146
±
0.002
[3.71
±
0.05]
0.174
±
0.002
[4.42
±
0.05]
©
1997 Microchip Technology Inc.
0.1043
±
0.002
[2.65
±
0.05]
TYP.
0.090 [2.29] MIN EPOXY
FREE AREA (TYP.)
MODULE DIMENSIONS
0.270 [6.86] MAX.
0.419
±
0.002
[10.63
±
0.05]
A
A
0.209
±
0.002
[5.31
±
0.05]
0.1043
±
0.002
[2.65
±
0.05]
(8x)
0.232
±
0.002
[5.90
±
0.05]
DIE
GLOB SIZE
0.0235 [0.60] MAX.
0.015 [0.38] MAX.
0.004 [0.10] MAX.
CONTACT SIDE
SECTION A-A
FR4 TAPE
0.007 [0.18] MAX.
COPPER BASE NICKEL PLATED, 150
GOLD FLASH 3-7
m
IN
MIN
24LC01B/02B Modules
DS21222A-page 9
m
IN