11AAXXX/11LCXXX
APPENDIX A: REVISION HISTORY
Revision A (10/07)
Original release of this document.
Revision B (01/08)
Revised SOT-23 Package Type; Revised DFN
package to TDFN; Section 3.3 (added new bullet item);
Section 4.5 note; Table 7-1.
Revision C (03/08)
Removed patent pending notice; Revised Tables 1-1
and 1-2; Section 3.3 (bullet 3) and 3.7 (bullet 2);
Product ID System.
Revision D (04/08)
Revised document status to Preliminary; General
updates.
Revision E (09/08)
Updated UNI/O trademark; Revised Table 1-2,
parameters 3 and 5; Updated package drawings.
Revision F (10/09)
Added 3-lead TO-92 Package.
Revision G (12/09)
Added 11AA161/11LC161 device.
Revision H (03/10)
Added 4-lead Chip Scale package.
2010 Microchip Technology Inc.
Preliminary
DS22067H-page 37