SG117A/SG117SERIES
ABSOLUTE MAXIMUM RATINGS (Note 1)
Power Dissipation ........................................
Operating Junction Temperature
Internally Limited
Input to Output Voltage Differential .................................
Hermetic (K, R, T, L, IG-Packages) ............................
Lead Temperature (Soldering, 10 Seconds) ..............
40V
150°C
300°C
Storage Temperature Range ..........................
-65°C to 150°C
Note 1. Exceeding these ratings could cause damage to the device.
THERMAL DATA
K Package:
Note A. Junction Temperature Calculation: TJ = T + (PD x θJA).
Thermal Resistance-Junction to Case, θJC ................. 3.0°C/W
Thermal Resistance-Junction to Ambient, θJA .............. 35°C/W
R Package:
Thermal Resistance-Junction to Case, θJC ................. 5.0°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 40°C/W
T Package:
Thermal Resistance-Junction to Case, θJC .................. 15°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 120°C/W
IG Package:
Note B. The above numbers for θJC are maximuAms for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The θJA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Thermal Resistance-Junction to Case, θJC ................. 3.5°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 42°C/W
L Package:
Thermal Resistance-Junction to Case, θJC .................. 35°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 120°C/W
RECOMMENDED OPERATING CONDITIONS (Note 2 & 3)
Input Voltage Range .............................. (VOUT + 3.5V) to 37V
Operating Junction Temperature Range
SG117A/SG117 ......................................... -55°C to 150°C
SG217A/SG217 ......................................... -25°C to 150°C
SG317A/SG317 ............................................ 0°C to 125°C
Note 2. Range over which the device is functional.
Note 3. These ratings are applicable for junction temperatures of less than 150°C.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG117A/SG117 with -55°C≤ TA ≤ 125°C, SG217A/
SG217 with -25°C ≤ TA ≤ 150°C, SG 317A/SG317 with 0°C ≤ TA ≤ 125°C, VIN - VOUT = 5.0V , and for IOUT = 500mA (K, R, and IG), and IOUT = 100mA
(T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the T and L
packages, and 20W for the K, R, and IG packages. IMAX is 1.5A for the K, R, and IG packages and 500mA for the T and L packages. Low duty cycle
pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
SG117A/SG217A
Min. Typ. Max. Min. Typ. Max.
1.238 1.250 1.262
SG117/SG217
Parameter
Test Conditions
IOUT = 10mA TA = 25°C
Units
Reference Voltage
V
3V ≤ (VIN - VOUT) ≤ 40V, P ≤ PMAX
,
10mA ≤ IOUT ≤ IMAX
1.225 1.250 1.270 1.20 1.25 1.30
V
Line Regulation (Note 4)
Load Regulation (Note 4)
3V ≤ (VIN - VOUT) ≤ 40V, IL = 10mA
TA = 25°C
0.005 0.01
0.01 0.02
0.01 0.02
0.02 0.05
%/V
%/V
TA = TMIN to T
10mA ≤ IOUT ≤ MIMAAXX
V
V
V
≤ 5V, TA = 25°C
OUT ≥ 5V, TA = 25°C
OUT ≤ 5V
5
15
0.3
50
1
5
15
0.3
50
1
mV
%
mV
%
0.1
20
0.3
0.1
20
0.3
VOOUUTT ≥ 5V
Thermal Regulation (Note 5)
Ripple Rejection
TA = 25°C, 20ms pulse
0.002 0.02
0.03 0.07
%/W
V
OUT = 10V, f =120Hz
CADJ = 1µF, TA = 25°C
ADJ = 10µF
65
80
50
65
80
50
dB
dB
µA
µA
C
66
66
Adjust Pin Current
100
5
100
5
Adjust Pin Current Change
10mA ≤ IOUT ≤ IMAX , 2.5V ≤ (VIN - VOUT) ≤ 40V
0.2
0.2
2/93 Rev 1.2 10/02
LINFINITY Microelectronics Inc.
Copyright 1994
11861 Western Avenue ∞ Garden Grove, CA 92841
(714) 898-8121 FAX: (714) 893-2570
2
∞
MICRO-ELECTRONICS [ Micro Electronics ]
