Micrel, Inc.
MIC5219
10
8
10
8
10
8
100mA
100mA
100mA
200mA
6
6
6
200mA
200mA
300mA
4
4
4
300mA
300mA
60
400mA
2
0
2
2
500mA
400mA
400mA
20
500mA
40
500mA
40
DUTY CYCLE (%)
0
0
0
0
0
0
20
60
80
100
0
60
80
100
0
20
40
80
100
DUTY CYCLE (%)
DUTY CYCLE (%)
a. 25°C Ambient
b. 50°C Ambient
c. 85°C Ambient
Figure 1. MIC5219-x.xBM5 (SOT-23-5) on Minimum Recommended Footprint
10
8
10
8
10
8
100mA
100mA
100mA
200mA
6
200mA
6
6
200mA
300mA
4
4
4
300mA
80
400mA
20
300mA
2
2
2
400mA
20
400mA
500mA
20 40
500mA
40 60
500mA
40 60
DUTY CYCLE (%)
0
0
0
80
100
0
100
0
60
DUTY CYCLE (%)
80
100
DUTY CYCLE (%)
a. 25°C Ambient
b. 50°C Ambient
c. 85°C Ambient
2
Figure 2. MIC5219-x.xBM5 (SOT-23-5) on 1-inch Copper Cladding
10
8
10
8
10
8
100mA
300mA
100mA
100mA
200mA
6
6
6
200mA
200mA
300mA
300mA
4
4
4
400mA
20
400mA
20
2
2
2
400mA
500mA
500mA
40
500mA
20 40
DUTY CYCLE (%)
0
0
0
40
60
80
100
0
60
80
100
0
60
80
100
DUTY CYCLE (%)
DUTY CYCLE (%)
a. 25°C Ambient
b. 50°C Ambient
c. 85°C Ambient
Figure 3. MIC5219-x.xBMM (MSOP-8) on Minimum Recommended Footprint
10
8
10
8
10
8
200mA
300mA
100mA
300mA
200mA
300mA
200mA
6
6
6
400mA
400mA
4
4
4
400mA
20
500mA
500mA
2
2
2
500mA
40
0
0
0
20
40
60
80
100
0
20
40
60
80
100
0
60
80
100
DUTY CYCLE (%)
DUTY CYCLE (%)
DUTY CYCLE (%)
a. 25°C Ambient
b. 50°C Ambient
c. 85°C Ambient
2
Figure 4. MIC5219-x.xBMM (MSOP-8) on 1-inch Copper Cladding
June 2009
11
M0371-061809
MICREL [ MICREL SEMICONDUCTOR ]
