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MIC37101-2.5YM 参数 Datasheet PDF下载

MIC37101-2.5YM图片预览
型号: MIC37101-2.5YM
PDF下载: 下载PDF文件 查看货源
内容描述: 1A低电压U CAP的LDO稳压器 [1A LOW VOLTAGE U CAP LDO REGULATOR]
分类和应用: 稳压器
文件页数/大小: 15 页 / 165 K
品牌: MICREL [ MICREL SEMICONDUCTOR ]
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MIC37100/37101/37102  
Micrel  
Minimum Load Current  
been used by MOSFET manufacturers for years, proving  
very reliable and cost effective for the user.  
The MIC37100/01/02 regulator is specified between finite  
loads. If the output current is too small, leakage currents  
dominateandtheoutputvoltagerises.A10mAminimumload  
current is necessary for proper regulation.  
Thermal resistance consists of two main elements, θ  
JC  
(junction-to-casethermalresistance)andθ (case-to-ambi-  
CA  
ent thermal resistance). See Figure 3. θ is the resistance  
JC  
from the die to the leads of the package. θ is the resistance  
Adjustable Regulator Design  
CA  
from the leads to the ambient air and it includes θ (case-to-  
CS  
sink thermal resistance) and θ  
resistance).  
(sink-to-ambient thermal  
SA  
MIC37102  
VIN  
IN  
OUT  
VOUT  
COUT  
R1  
R2  
ENABLE  
SHUTDOWN  
EN  
ADJ  
GND  
SOIC-8  
R1  
R2  
V
= 1.240V 1+  
OUT  
Figure 2. Adjustable Regulator with Resistors  
The MIC37102 allows programming the output voltage any-  
where between 1.24V and the 6V maximum operating rating  
of the family. Two resistors are used. Resistors can be quite  
large, up to 1M, because of the very high input impedance  
and low bias current of the sense comparator: The resistor  
values are calculated by:  
θJA  
ground plane  
heat sink area  
θJC  
θCA  
AMBIENT  
printed circuit board  
VOUT  
Figure 3. Thermal Resistance  
R1= R2  
1  
1.240  
Using the power SOIC-8 reduces the θ dramatically and  
JC  
Where V is the desired output voltage. Figure 2 shows  
allows the user to reduce θ . The total thermal resistance,  
O
CA  
component definition. Applications with widely varying load  
currents may scale the resistors to draw the minimum load  
current required for proper operation (see above).  
θ
(junction-to-ambient thermal resistance) is the limiting  
factor in calculating the maximum power dissipation capabil-  
ity of the device. Typically, the power SOIC-8 has a θ of  
JA  
JC  
20°C/W, this is significantly lower than the standard SOIC-8  
Power SOIC-8 Thermal Characteristics  
which is typically 75°C/W. θ  
is reduced because pins 5  
CA  
One of the secrets of the MIC37101/02s performance is its  
power SO-8 package featuring half the thermal resistance of  
a standard SO-8 package. Lower thermal resistance means  
more output current or higher input voltage for a given  
package size.  
through 8 can now be soldered directly to a ground plane  
which significantly reduces the case-to-sink thermal resis-  
tance and sink to ambient thermal resistance.  
Low-dropout linear regulators from Micrel are rated to a  
maximum junction temperature of 125°C. It is important not  
to exceed this maximum junction temperature during opera-  
tionofthedevice.Topreventthismaximumjunctiontempera-  
ture from being exceeded, the appropriate ground plane heat  
sink must be used.  
Lower thermal resistance is achieved by joining the four  
ground leads with the die attach paddle to create a single-  
piece electrical and thermal conductor. This concept has  
M9999-091604  
12  
September 2004  
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