MIC2551A
Micrel
Package Information
4.50 (0.177)
6.4 BSC (0.252)
4.30 (0.169)
DIMENSIONS:
MM (INCH)
0.30 (0.012)
0.19 (0.007)
5.10 (0.200)
4.90 (0.193)
1.10 MAX (0.043)
0.20 (0.008)
0.09 (0.003)
0.65 BSC
(0.026)
0.15 (0.006)
0.05 (0.002)
8°
0°
1.00 (0.039) REF
0.70 (0.028)
0.50 (0.020)
14-lead TSSOP (TS)
0.85
+0.15
–0.65
3.00BSC
2.75BSC
16
1
0.42
+0.18
–0.18
0.23
+0.07
–0.05
0.01
+0.04
–0.01
1.60
+0.10
–0.10
0.42
+0.18
–0.18
N
1
0.65
+0.15
–0.65
0.20 REF.
PIN 1 ID
0.50 DIA
2
3
4
2.75BSC 3.00BSC
2
3
4
1.60
+0.10
–0.10
12° max
SEATING
PLANE
TOP VIEW
CC
C
L
4
0.23
+0.07
–0.05
0.01
+0.04
–0.01
1.
2.
3.
4.
0.42
+0.18
–0.18
0.5 BSC
1.5 REF
BOTTOM VIEW
0.40
+0.05
–0.05
0.5BSC
FOR EVEN TERMINAL/SIDE
SECTION "C-C"
SCALE: NONE
DIMENSIONS ARE IN mm.
DIE THICKNESS ALLOWABLE IS 0.305mm MAX.
PACKAGE WARPAGE MAX 0.05mm.
THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.20mm AND 0.25mm FROM TIP.
5. APPLIES ONLY FOR TERMINALS
Rev. 02
16-Pin MLF™ (ML)
M9999-051004
10
May 2004
MICREL [ MICREL SEMICONDUCTOR ]
