2.8V
Low-Power CMOS Oscillator
DSC1028
Board Layout (recommended)
Solder Reflow Profile
20-40
Sec
260°C
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/Sec Max.
217°C
200°C
60-150
Sec
Preheat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
Time within 5°C of actual Peak
Ramp-Down Rate
60-180 Sec
60-150 Sec
255-260°C
20-40 Sec
6°C/Sec Max.
8 min Max.
Reflow
60-180
Sec
150°C
Cool
Pre heat
Time 25°C to Peak Temperature
25°C
Time
8 min max
Package Dimensions
7.0 x 5.0 mm Plastic Package
External Dimensions
Recommended Land Pattern*
7.0±0.10 [0.276±0.004]
5.08 [0.200]
5.08 [0.2]
#4
#3
#4
#3
2.6 [0.102]
2.6 [0.102]
0.2 [0.008]
o
o
o
o
o
o
3.5 [0.138]
1.4 [0.055]
2.2 [0.087]
#2
#1
#1
#2
1.4 [0.055]
0.2 [0.008]
0.2 [0.008]
5.0±0.10 [0.197±0.004]
0.85±0.05 [0.033±0.002]
1.4 [0.055]
1.2 [0.047]
*Note: The center pad is not connected
internally and should be left un-
connected or tied to GND.
No.
Pin Terminal
Standby#
GND
1
2
3
4
Output
VDD
units: mm [inch]
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to the contents, products, programs or services described at any time without notice. This document neither states nor implies any kind of warranty, including, but not limited to
implied warranties of merchantability or fitness for a particular use.
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