1.8~3.3V
Low-Power Precision CMOS Oscillator
DSC1001
Board Layout (recommended)
Solder Reflow Profile
20-40
Sec
260°C
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/Sec Max.
217°C
200°C
60-150
Sec
Preheat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
Time within 5°C of actual Peak
Ramp-Down Rate
60-180 Sec
60-150 Sec
255-260°C
20-40 Sec
6°C/Sec Max.
8 min Max.
Reflow
60-180
Sec
150°C
Cool
Pre heat
Time 25°C to Peak Temperature
25°C
Time
8 min max
Package Dimensions
7.0 x 5.0 mm Plastic Package
External Dimensions
Recommended Land Pattern*
7.0±0.10 [0.276±0.004]
5.08 [0.200]
5.08 [0.2]
#4
#3
#3
#4
2.6 [0.102]
0.2 [0.008]
2.6 [0.102]
o
o
o
o
o
o
3.5 [0.138]
1.4 [0.055]
2.2 [0.087]
#2
#1
#1
#2
1.4 [0.055]
0.2 [0.008]
0.2 [0.008]
5.0±0.10 [0.197±0.004]
0.85±0.05 [0.033±0.002]
1.4 [0.055]
1.2 [0.047]
*Note: The center pad is not connected
internally and should be left un-
connected or tied to GND.
No.
Pin Terminal
Standby#
GND
1
2
3
4
Output
VDD
units: mm [inch]
MK-Q-B-P-D-050610-01-9
Page 6
MICREL [ MICREL SEMICONDUCTOR ]
