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QHD-2M-3.0G 参数 Datasheet PDF下载

QHD-2M-3.0G图片预览
型号: QHD-2M-3.0G
PDF下载: 下载PDF文件 查看货源
内容描述: QUAD HYBRID [QUAD HYBRID]
分类和应用: 射频微波分离技术隔离技术
文件页数/大小: 5 页 / 133 K
品牌: MERRIMAC [ MERRIMAC INDUSTRIES, INC. ]
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QHD-2M-3.0G
QUAD HYBRID
REV: 003, 03/05/02
• 2.0 - 4.0 GHz
• LOWEST LOSS
• HIGHEST ISOLATION
• BEST PHASE/AMPLITUDE BALANCE
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX
®
QUAD HYBRIDS
The Multi-Mix
®
QHD series provides a 3 dB coupler with low insertion loss, low VSWR, and high
isolation. Accurate phase and amplitude balance make them ideal for applications involving IQ
networks, power amplifiers, signal distribution and processing.
QHD quad hybrids are fusion bonded multilayer stripline assemblies. The fusion bonding process yields
a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance
that is superior to conventional adhesive bonding techniques.
The QHD series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground
plane provides excellent EM shielding.
Additional benefits include:
AVAILABLE ON
TAPE & REEL
• Available on tape and reel.
• Cost effective for commercial wireless applications.
• Industry standard size.
• Temperature stable from –65 to +125 degrees C.
• Can be integrated with other Multi-Mix
®
components in a multi-function module.
RELIABILITY
All QHD series components are 100% tested. The product family has passed environmental screening
per MIL-TSD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture
Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).
THE MULTI-MIX
®
PROCESS
Multi-Mix
®
is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is ready for pick and
place.
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO-9001 REGISTERED
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com